Open Innovation in the Semiconductor Design Community

By • on June 3, 2011

HSINCHU, Taiwan, May 26, 2011 /PRNewswire/ — TSMC (TWSE: 2330, NYSE: TSM) announced today that 28nm support within the Open Innovation Platform™ (OIP) design infrastructure is fully delivered, as demonstrated by 89 new 28nm designs scheduled to tapeout.  The company will also introduce OIP enhancements, including the delivery of Reference Flow 12.0 and Analog/Mixed Signal (AMS) Reference Flow 2.0 at the upcoming Design Automation Conference (DAC) in San Diego, Calif.

TSMC’s 28nm design ecosystem is ready today with foundation collateral such as DRC, LVS and PDKs; foundation IP, including standard cell libraries, standard I/O, eFuse and memory compilers; and standard interface IP such as USB, PCI and DDR/LPDDR.  Customers can download these materials at TSMC Online.  Collaboration with the EDA community for 28nm has been equally thorough in order to achieve tool consistency for improved design results.  One example is a unified DFM engine for 28nm now in use by Cadence, Mentor and Synopsys.

Click here to read the full press release.

Image via flickr.

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