TSMC Expands Open Innovation Platform Ecosystem

By • on October 31, 2022

EE Times Asia reported that Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) is expanding its Open Innovation Platform (OIP) ecosystem with the launch of the 3DFabric Alliance at the 2022 Open Innovation Platform Ecosystem Forum. The new TSMC 3DFabric Alliance is TSMC’s sixth OIP Alliance and the first of its kind in the semiconductor industry that joins forces with partners to accelerate 3D IC ecosystem innovation and readiness.

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