Cadence Wins Six 2022 TSMC Open Innovation Platform Partner of the Year Awards
Business Wire reported that Cadence Design Systems has won six Open Innovation Platform Partner of the Year awards from Taiwan Semiconductor Manufacturing Company (TSMC) for its Electronic Design Administration, intellectual property and cloud solutions. Cadence was presented with awards for the joint development of the N3E design infrastructure, 3Dblox Design Solution, analog migration flow, RF design solutions, cloud-based productivity solution and DSP IP. In addition, Cadence was recognized as a founding member of the TSMC 3DFabric Alliance.